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preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 1 general description the ap386x is a low-cost high-resolution single chip solution for apa (all point addressable) capacitive touch screen. it is an 8-bit single cycle 8051 microcontroller with icp in terface. the chip includes 12-bit successive approxim ation analog-to-digital converters with an i 2 c interface and multiplexer-switcher circuits for flexible measurement of analog sign al from apa panel. an accurate switched-capacitor in tegrator is built-in and it can auto calibrate the pixel parameters for a wide range of capacitance on the touch screen (1pf to 32pf). this touch screen controller (tsc) with cmos integration circuit provides an ideal choice for apa touch panel. the ap386x is specified over the temperature range of -40c to 85c. the ap386x is availabl e in qfn-55-40 (for AP3860) and qfn-66-48 (for ap3861) packages. features ? mutual capacitive touch sensing ? single power supply: 2.8v to 3.6v operation voltage; ldo inside to support 1.6v to 2.0v operation voltage ? up to 17/23 drive lines and 10/12 sense lines ? charge pump support up to 6v, doubling snr ? internal two-wire serial control bus i 2 c ? single-end integrator with programmable gain control ? multiplexed analog digitization with 12-bit resolution scan sar adcs and its dedicated 2x to 8x accumulator xsram buffers features (continued) ? single cycle 8051 cpu core, maximum opera- ting clock up to 28mhz from iosc (zero wait state) 4 to 28mhz internal oscillator (iosc) 32k-byte flash rom 6k-byte internal sram two 16-bit timers t0/t1 configurable i 2 c slave controller and spi slave controller shared with the same ports ? with asynchronous i 2 c slave address detection logic design 4 general purpose gpio pins one external interrupt pin ? isp/iap via i2c port ? operation temperature range: -40c to 85c ? package type altern atives: qfn-55-40 and qfn-66-48 ? rohs compliance ? operating mode: mode description power-down no scan with power-down mode idle while only 8051 cpu core is idle, all peripherals remain active standard higher scan rate when fingers are on panel, iosc can up to 4mhz to 28mhz applications ? mobile phones ? personal digital assistants ? smart hand-held or gaming devices figure 1. package types of ap386x qfn-55-40 qfn-66-48
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 2 pin configuration fn package (qfn-55-40) pin 1 mark 31 32 33 34 35 36 37 38 39 40 21 22 23 24 25 26 27 28 29 30 11 12 13 14 15 16 17 18 19 20 4 5 6 7 8 9 2 10 3 1 s2 s3 s4 s5 s6 s7 s8 s9 d16 s1 d15 d14 d13 d12 d11 d10 d9 d8 d7 d6 d1 d2 d3 d4 d5 d0 vddhv vdd3v vss vdd18 testen ss/scl sck/gpio3 mosi/sda miso/gpio2 rstn wake/gpio0 int/gpio1 s0 vdd3v 41 figure 2. pin configurat ion of AP3860 (top view)
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 3 pin configuration (continued) fn package (qfn-66-48) d9 d8 d7 d6 d5 d4 d3 d2 d1 d0 vddhv vdd3v s2 s3 s4 s5 s6 s7 s8 s9 s1 s10 s11 d22 figure 3. pin configurat ion of ap3861 (top view)
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 4 pin description pin number pin name pin type pin function qfn-55 - 40 AP3860 qfn-66 - 48 ap3861 40, 1 to 16 6 to 22 d16 to d0 i/o, a driving lines 16 to 0 these pins can also be configured as i/o bi-directional ports for test - 48, 1 to 5 d22 to d17 i/o, a driving lines 22 to 17 these pins can also be configured as i/o bi-directional ports for test 17 23 vddhv o high voltage. 6v charge pump high voltage. this output pin can be configured as vdd3v or 6v accordingly 18, 30 24, 35 vdd3v p supply voltage. 2.8v to 3.6v a good decoupling capacitor between vdd3v and vss pins is critical for good performance 19 25 vss p ground voltage. 0v 20 26 vdd18 o internal regulator output. 1.6v to 2.0v typical decoupling capacitors of 0.1 ? ? 21 27 testen i test mode enable high active this pin has an internal weakly pull low resistor connected. if it is connected high, the chip enters into test mode condition 22 28 ss/scl i/o ss/scl this pin can be configured as the scl signal of the i 2 c master or i 2 c slave controller. when i 2 c is enabled, the pin is configured as an open-collector. while in spi mode, this pin is configured as the slave chip select pin 23 29 sck/ gpio3 i/o port 1.3 gpio 8051 p1.3 gpio. this pin can also be configured as the serial clock from spi master while spi interface is activated 24 30 mosi/ sda i/o sda this pin can be configured as the sda signal of the i 2 c master or i 2 c slave controller. in this operation mode, this pin should also be configured as open-collector. while spi interface is selected, the pin serves as the data port from spi master to spi slave 25 31 miso/ gpio2 i/o port 1.2 gpio 8051 p1.2 gpio. this pin can also be configured as the output data pin from slave to master for spi interface
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 5 pin description (continued) pin number pin name pin type pin function qfn-55 - 40 AP3860 qfn-66 - 48 ap3861 26 32 rstn i reset low active typically connect a resistor to vdd3v and a capacitor to vss. low asserted and threshold at 0.5*v dd . when forced low, the chip enters into reset condition. this pin should not be connected to any level above v dd 27 33 wake/ gpio0 i/o port 1.0 gpio 8051 p1.0 gpio. this pin can also be configured as the wakeup pin from the host 28 34 int/ gpio1 i/o port 1.1 gpio 8051 p1.1 gpio. open drain output. this pin can also be configured as the interrupt pin to notify the host 29, 31 to 39 36 to 45 s0 to s9 i/o, a sensing lines 0 to 9 these pins can also be configured as i/o bi-directional ports for test - 46, 47 s10, s11 i/o, a sensing lines 10 to 11 these pins can also be configured as i/o bi-directional ports for test 41 49 ep exposed pad ?i/o? means input/output; ?i? m eans input; ?o? means ou tput; ?p? means power; ?a? means analog. scl and sda pin description pull-up enable the pull-up enable for scl and sda is activated for ap386x, meaning that ap386x always has pull-up scl and sda to vdd3v. during reset, scl and sda are as inpu t pin. moreover, if the pin connecting to the system is floating, the internal pull-up will tie the pin to vdd3v (10k ? ). after ap386x is reset, scl and sda are input until its corresponding register is configured. mode selection scl and sda can be used in i 2 c and spi mode. ap386x can enable i 2 c mode (scl and sda configured as open drain pin) by register setting. wakeup scl and sda can be used for wakeup input signals in different mode. while i 2 c mode is enabled, a start protocol (sda is low and scl is high) on scl and sda is a wakeup signal to ap386x. while spi mode is enabled, an active low on th e pin of scl (serving as a slave select in spi) is a wakeup signal to ap386x. moreover, a wakeup signal can be asserted by host from gpio0. int/gpio1 gpio1 can be configured as open-drain or push-pull mode. furthermore, gpio1 pin has internal pull-up to vdd3v (60k ? ) or vdd18 (10k ? ) based on different register definition.
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 6 functional block diagram switch matrix figure 4. functional block diagram of ap386x
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 7 g1: green blank: tray tr: tape & reel ordering information ap386 - circuit type package temperature range part number marking id packing type qfn-5x5-40 -40 to 85c AP3860fntr-g1 3860fn tape & reel qfn-6x6-48 ap3861fn-g1 3861fn tray ap3861fntr-g1 3861fn tape & reel bcd semiconductor's pb-free products, as designated wi th "g1" in the part number, are rohs compliant and green. ap386x support 3? to 8? to uch panel, listed below: pn tx/rx multi-touch package panel size AP3860 17/10 10 points 100hz qfn-5x5-40 3? to 7? ap3861 23/12 10 points 100hz qfn-6x6-48 4? to 8? package fn: qfn-55-40 /qfn-66-48 0: AP3860 1: ap3861
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 8 absolute maximum ratings (note 1) parameter symbol value unit supply voltage (pin vdd3v) v dd 0 to 4 v analog input voltage (other pins) -0.3 to v dd +0.3 v logic input voltage -0.3 to v dd +0.3 v thermal resistance (simulation, junction to ambient) ? ja tbd c/w maximum junction temperature t j 100 c operating temperature t op -40 to 85 c storage temperature t stg -65 to 150 c esd (human body model) esd hbm 8000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit supply voltage (pin vdd3v) v dd 2.8 3.6 v operating ambient temperature t a -40 85 oc
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 9 electrical characteristics t a =25c, v dd =2.8v to 3.6v, i 2 c bus frequency=400khz, 12-bit mode, unless otherwise noted. parameter symbol conditions min typ max unit quiescent current standard mode f osc =4 to 28mhz power-down mode idle mode 5 60 1 ma ? a ? a vdd18 output voltage v dd18 1.6 1.8 2.0 v charge pump voltage v ddhv charge pump enable 5.8 6 6.3 v internal operating frequency f osc 4 28 mhz da/ac characteristics for afe parameter symbol conditions min typ max unit adc dc accuracy resolution 12 bits no missing codes standard modes 11 12 bits integral linearity error inl standard modes 3 lsb differential linearity error offset error gain error dnl 1.5 6 4 lsb lsb lsb analog input full-scale input span 0 v dd v adc sampling dynamics throughput rate 500 ksps switched-capacitor integrator output voltage range 0.3 v dd -0.3 v integrator capacitor c int 40 pf
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 10 electrical characteristics (continued) da/ac characteristics for 8051 cpu core, digital gpio pins, digital peripherals parameter symbol conditi ons min typ max unit rstn input voltage threshold v rstn_h low to high level 1.56 1.71 v v rstn_l high to low level 1.16 1.30 input high voltage v ih 0.7*v dd v dd v input low voltage v il -0.3 0.5 v output high voltage v oh v dd -0.6 v output low voltage v ol 0.4 v high level output current i oh @v oh (min) 1 ma low level output current i ol @v ol (max) 1 ma internal pull-up resistance r pu scl, sda, int 10 k ?? other pins 34 74 internal pull-down resistance r pd 29 86 k ? output rise time t rise c load =20pf and 10% to 90% 5 ns output fall time t fall c load =20pf and 10% to 90% 5 ns gpio output operating frequency c load =20pf 0 5 mhz sck frequency f sck 2 mhz scl clock frequency f scli2c 0 400 khz
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 11 typical application figure 5. typical application schematic of AP3860 (for qfn-55-40 package) figure 6. typical application schematic of ap3861 (for qfn-66-48 package) AP3860 ap3861
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 12 mechanical dimensions qfn-55-40 unit: mm(inch)
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 13 mechanical dimensions (continued) qfn-66-48 unit: mm(inch) 5.900(0. 232) 6.100(0. 240) 6.100(0.240) 5.900(0.232) pin 1 mark 0.400 ( 0. 016) bsc 0.000(0. 000) 0.050(0. 002) 0.200(0.008) ref 0.150(0. 006) 0.250(0. 010) n1 n13 n25 n37 n48 0.300(0. 012) 0.500(0. 020) pin # 1 identification see detail a 1 2 pin 1 options detail a 3 48 47 46 1 2 3 48 47 46 1 2 3 48 47 46 . symbol j=k a min(mm) max(mm) max(mm) min(mm) min(inch) min(inch) max(inch) max(inch) option1 option2 4.400 4.150 4.600 4.450 0.173 0.181 0.163 0.175 0.800 0.900 0.700 0.800 0.028 0.031 0.031 0.035 j k a
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 14 mounting pad layout qfn-55-40 dimensions x=y (mm)/(inch) x1=y2 (mm)/(inch) y1=x2 (mm)/(inch) x3=y3 (mm)/(inch) e (mm)/(inch) option1 5.400/0.213 0.250/0.010 0.650/0.026 3.500/0.138 0.400/0.016 option2 5.400/0.213 0.250/0.010 0.650/0.026 3.600/0.142 0.400/0.016 option3 5.400/0.213 0.250/0.010 0.650/0.026 3.800/0.150 0.400/0.016
preliminary datasheet superior multi-touch capacitive touc h screen controller ap386x aug. 2013 rev. 1. 0 bc d semiconductor manuf acturing limited 15 mounting pad layout (continued) qfn-66-48 dimensions x=y (mm)/(inch) x1=y2 (mm)/(inch) y1=x2 (mm)/(inch) x3=y3 (mm)/(inch) e (mm)/(inch) value 6.300/0.248 0.250/0.010 0.600/0.024 4.600/0.181 0.400/0.016
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yishan road, shanghai 200233, china tel: +021-6485-1491, fa x: +86-021-5450-0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manu facturing co., ltd., shenzhen office unit a room 1203,skyworth bldg., gaoxin ave.1.s., nanshan district shenzhen 518057, china tel: +86-0755-8660-4900, fax: +86-0755-8660-4958 taiwan office (taipei) bcd semiconductor (taiwan) company limited 3f, no.17, lane 171, sec. 2, jiu-zong rd., ne i-hu dist., taipei(114), taiwan, r.o.c tel: +886-2-2656 2808 fax: +886-2-2656-2806/26562950 taiwan office (hsinchu) bcd semiconductor (taiwan) company limited 8f, no.176, sec. 2, gong-dao 5th road, east district hsinchu city 300, taiwan, r.o.c tel: +886-3-5160181, fax: +886-3-5160181 - headquarters bcd (shanghai) micro-electronics limited no. 1600, zi xing road, shanghai zizhu scie nce-based industrial park, 200241, p. r.c. tel: +86-021-2416-2266, fax: +86-021-2416-2277 usa office bcd semiconductor corp. 48460 kato road, fremont, ca 94538, usa tel: +1-510-668-1950 fax: +1-510-668-1990 korea office bcd semiconductor limited korea office. room 101-1112, digital-empire ii, 486 sin-dong, yeongtong-gu, suwon-city, gyeonggi-do, korea tel: +82-31-695-8430 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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